The Small Scale Systems Integration and Packaging (S3IP) Center is dedicated to the creation and development of new electronic applications that will enhance the way people live and interact with their surroundings.
The Small Scale Systems Integration and Packaging (S3IP) Center is a research and development organization that addresses research challenges in small scale system design, process development, prototyping, and manufacturing for academia and the microelectronics industry.
Located at Binghamton University, the Center brings together partners from government, industry and academia, providing opportunities for collaborations that will advance microelectronics research and development. The Center was designated as a New York State Center of Excellence in 2006.
State names BU a "Center of Excellence" for research
Binghamton University By Air Video
Dr. Bahgat Sammakia discusses flexible electronics on a “Sign of Science” Podcast
Nanostructured Thermal Interface Pastes for Microelectronic Cooling
SAVE THE DATE
August 19, 2009
2nd Annual Flexible Electronics Symposium
Binghamton University in collaboration with Cornell University introduces NSF Integrative Graduate Education and Research Traineeship (IGERT) Award.
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