• Electron Microscopy Suite
The SEM Suite will allow for the delivery of high resolution surface information and informative images, providing leverage against challenging imaging requirements, for applications in materials analysis, life sciences, semiconductor technology and quality assurance. Tooling will offer the ability to investigate non-conducting specimens without intrusive preparation and the possibility to introduce water vapor at sufficient pressures to avoid dehydration damage. The following Tool set is available in this facility:
Zeiss Supra 55 VP, Analytical Ultra High Resolution FESEM + EDAX Pegasus EDS +
EBSD
Zeiss Supra 55 VP, Analytical Ultra High Resolution FESEM + EDAX Pegasus EDS +
EBSD
FEI FIB: Dual Beam-SEM/FIB
TEM: 200-kV Field Emission Transmission Electron Microscope
• Laser Microscopy Lab
The Suite will be useful for those in life sciences and engineering interested in recording fluid flow in channels, also include scanning confocal microscopy services and particle imaging velocimeter resources.The following tool sets are available in this facility:
Dantec PIV Particle Imaging Velocimeter
VT-Eye Ultra-fast Laser Confocal Imaging System
• X-Ray Imaging and Analysis
The X-Ray Imaging and Analysis Suite will enable advanced materials science and nanotechnology research, including metrologic characterization in semiconductor process development. Tools in this suite will handle a wide range of applications, ranging from life science and biotechnology (proteins, viruses, DNA complexes) to polymers, emulsions, liquid crystals, fibers and catalysts) and will especially suitable for thin film analysis applications.The following tool sets are available in this facility:
PANalytical X-Ray Diffraction
Phoenix X-Ray Imaging
Rigaku Small Angle Scattering and Large Angle Scattering Tool.
• General Microscopy Suite
This facility provides high resolution imaging services in bright field, dark field, polarized light and differential interference contrast imaging modes. Magnifications are available from 0.7x through 1000x, as seen through the eye piece. Images are captured on 5 mega-pixel, Peltier cooled, CCD cameras. Instruments are available for imaging on upright and inverted stage formats, and upright stereo imaging with the ability to acquire stereo image pairs. Imaging includes digital imaging services such as extended depth of field, image stitching and mosaics, image enhancement and quantitative image analysis. The digital imaging services provide both real time programmed control of the fully motorized microscopes and post processing image manipulation and analysis. Some of these services will be available online through the web. The following tool sets are available in this Suite:
Zeiss Axio Imager M1M Advanced Upright Compound Microscope
Zeiss AxioVert 200 Advanced Inverted Compound Microscope
Zeiss Discovery V 12 Advanced Stereo Zoom Microscope
Zeiss Computer Workstations 25A Imaging Processing Systems
• Surface Analysis Suite
This facility will enable high resolution 3-D surface characterization of MEMS, semiconductors, and other thin/thick films. The following tool sets are available in this facility:
AFM
Ellipsometer
Profilometers: stylus and optical
• Microfabrication Laboratory
The Lab will enable users to access lithography and other techniques to take build devices out of silicon for various microelectronics applications. The laboratory clean room will equipped with such tools as mask aligners, spinners for coating, wafer developers, wafer dicers, and optical microscopes.
• Thermal Analysis Suite
Thermal Analysis Suite (TAS) has seven instruments; Differential Scanning Calorimetry (DSC), Thermo Gravimetric Analyzer (TGA), Thermo Mechanical Analyzer (TMA), Dynamic Mechanical Analyzer (DMA), Thermo Gravimetric Analysis with Mass Spectrometry (TGA/MS), Thermal Diffusivity System (TDS), and Rheometer. TAS provides various analytical and measurements techniques for research, development, education, process, and quality control applications applications. A summary of TAS capability is as follows.
Accurate measurement of glass transition temperature, melting point, and other types of the first order transition temperature
Determination of weight loss/gain as a function of temperature and their rates for various compounds
Determination of the byproducts of thermal decomposition of compounds
Determination of thermal diffusivity, specific heat capacity, thermal conductivity
Determination of linear and volumetric expansion
Determination of the crystallinity level of a polymer system
De termination of dielectric properties
Determination of relative levels of components in blends
Screening for levels and effectiveness of additives and stabilizers
Measurement of mechanical properties at various temperatures
Measurement of rheological properties of polymeric materials
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